SCALE (Scalable Asymmetric Lifecycle Engagement)

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The United States of America and Purdue University have entered into a Prototype Project Agreement under the “Cornerstone” Other Transaction Authority (OTA) as of December 20, 2019. Under this agreement, Purdue University and its university partners, including the University of Tennessee-Chattanooga, to stand up and execute a sustainable Microelectronics Workforce Public-Private-Academic Partnership (PPAP) prototype model.

A single prototype process will be developed that applies across multiple microelectronic technology focus areas and multiple universities for scalability and replicability. Other key components will include a suite of efforts to attract students to DOD-relevant focus areas in microelectronics; nationwide curricular standards aligned with priorities driven by the Government Oversight Committee; and collaborative research to advance knowledge share. This project will allow us to develop, obtain, and maintain a knowledgeable microelectronics workforce for the defense microelectronics eco-system by introducing and implementing an innovative design-based engineering education methodology for metric-driven validation. The resulting program is expected to result in a specific yet adaptive ecosystem that will help increase the number of technically excellent, mission-driven students joining the defense microelectronics workforce. The prototype model will be initially developed to address two microelectronics focus areas: radiation hardened technology and heterogeneous integration/advanced packaging.

Through this multi-year effort UTC will be partnering with Vanderbilt, Air Force Institute of Technology St. Louis University, Brigham Young University, Arizona State University, Georgia Tech, Purdue University, and New Mexico State University to develop a radiation effects curriculum, involvement of undergraduate students in research, placement of students for internships in govt. labs and overall workforce development for the Department of Defense.

Resources:

Technical Areas

Radiation-Hardening

Radiation in natural and manmade environments can greatly affect the operation and long-term performance of microelectronics
Radiation hardening is making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation
Transient effects include single-event effects like memory bit flips; permanent effects include single-event latchups that prevent individual devices from operating
Mitigation approaches include radiation-hardening by process and radiation-hardening by design

Application Process

SCALE at UTC will provide mentoring, internship matching and targeted research projects for college students interested in microelectronics radiation-hardening.

If you are interested in participating in this program this academic year, and applying to a Summer 2022 internship or full-time position, then please click the button "Students apply here" on the left. Starting with this application, SCALE's recruitment team will collect your background and interests AND match you with government and industry internship opportunities. This match will ensure you receive the best fit for an internship to begin a successful career with effective mentoring in microelectronics.

Students Apply Here to be eligible for all summer 2022 internships (note that applications are accepted at any time during the year, but summer internships are limited). Students must be U.S. citizens to be eligible for funds.