SCALE (Scalable Asymmetric Lifecycle Engagement)

Purdue University and its university partners, including the University of Tennessee-Chattanooga, are executing a sustainable Microelectronics Workforce Public-Private-Academic Partnership (PPAP) prototype model, and CECS students are invited to join the program!

Program information and goals: A single prototype process will be developed that applies across multiple microelectronic technology focus areas and multiple universities for scalability and replicability. Other key components will include a suite of efforts to attract students to DOD-relevant focus areas in microelectronics; nationwide curricular standards aligned with priorities driven by the Government Oversight Committee; and collaborative research to advance knowledge share. This project will allow us to develop, obtain, and maintain a knowledgeable microelectronics workforce for the defense microelectronics eco-system by introducing and implementing an innovative design-based engineering education methodology for metric-driven validation. The program will result in a specific yet adaptive ecosystem that will help increase the number of technically excellent, mission-driven students joining the defense microelectronics workforce. The prototype model will be initially developed to address two microelectronics focus areas: radiation hardened technology and heterogeneous integration/advanced packaging.

Through this multi-year effort UTC has joined forces with more than 70 public-private partners, including universities, government agencies and organizations, and industry affiliates. Please visit the SCALE Partners list on the Purdue University website for more details.

Resources:

Overview of the SCALE program: https://research.purdue.edu/scale/about/index.php
Technical Areas: https://research.purdue.edu/scale/technical-areas/index.php
Presentation by Dr. Loveless on the SCALE program: https://www.seemapld.org/archive/2022/17_MAY_TUE/0830_C1-Loveless.pdf

Application Process

SCALE at UTC will provide mentoring, internship matching and targeted research projects for college students interested in one of the five technical areas within the program: radiation-hardening, system-on-chip, heterogeneous integration/advanced packaging, embedded systems/AI, and supply chain awareness.

If you are interested in participating in this program this academic year and applying to an internship or full-time position with an industry affiliate, please use the registration link below to submit your application and then send an email to Dr. Donald Reising SCALE's recruitment team will collect your background and interests and match you with government and industry internship opportunities. This match will ensure you receive the best fit for an internship to begin a successful career with effective mentoring in microelectronics.

Applications are accepted at any time during the year, but internships are limited. Students must be U.S. citizens to be eligible for funds.

Step One: Students Apply Here

Step Two: Contact Dr. Reising to Finalize Application